HDI PCB

HDI PCB technology creates many possibilities in a wide range of industries. To save manufacturing time and improve productivity, HDI technology is a very good choice.

HDI pcb introduction

High-density interconnection (HDI) PCB represents one of the fastest development technologies in PCBA processing. Because its circuit density is higher than that of traditional PCBA circuit boards, the HDI PCB design can contain smaller pores and capture pads, as well as higher -connected pad density. The HDI board contains blind holes and buried holes, and usually contains micro holes with a diameter of 0.006 or smaller.

By using HDI technology, designers can now place more components on both sides of the original PCB. With the development of pores and blind hole technology in pads, it allows designers to place smaller components together. This means faster signal transmission and significantly reduce signal loss and cross -delay.

The advantage of HDI PCB

High-quality PCB Assembly

The development of PCB HDI technology provides engineers with greater design freedom and flexibility than ever. If necessary, designers using HDI high-density interconnection methods can now place more components on both sides of the original PCB. In essence, HDI PCB provides designers with more working space, and at the same time allows them to place smaller components closer. This means that high-density interconnection PCB will eventually bring faster signal transmission and higher signal quality.

☆ The wiring is more dense
☆ The power is more stable
☆ Reduce EMC interference
☆ Improve signal integrity
☆ Accelerate the development of multi-layer PCB
☆ Suitable for SMD paste
☆ More component space

 

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HDI PCB Applications

HDI boards are appropriate for a wide range of industries. As mentioned above, you’ll find them in all types of digital devices, like smartphones and tablets, where miniaturization is key to the effective application of the product. You can also find high-density interconnect PCBs in automobiles, aircraft and other vehicles that rely on electronics.

One of the most critical areas where the high-density PCB is making huge inroads is in the medical arena. Medical devices frequently need small packages with high transmission rates that only HDI PCBs can supply. For example, an implant needs to be small enough to fit in the human body, but any electronics involved in that implant absolutely must efficiently allow for high-speed signal transmission. Here, the HDI PCB indeed is a godsend. HDI PCBs can also be useful in other medical equipment, like emergency room monitors, CT scans and much more.

No matter your industry, you’re probably already getting some ideas about how high-density interconnect PCBs can make the electronics you produce or use even better-get in touch with us LSTpcb to discuss it. We’ll let you know if you’re on the right track and help you decide exactly how beneficial an HDI PCB can be to your industry. Then, you can determine whether or not to take the next step.

Our ability

project

unit

Parameter/model

HDI Structure

 

1+N+1、2+N+2、3+N+3、4+N+4、5+N+5、6+N+6、anylayer

Structure order

 

N+N、N+X+N、1+(N+X+N)+1

Number of layers that can be created

1-42 layers

 

Minimum line width/spacing

Unit: mil

2\2

Minimum mechanical holes

Unit: mm

0.15mm

Minimum core plate thickness

Unit: mil

2mil

Laser hole diameter

Unit: mm

0.075mm-0.1mm

Minimum thickness of insulation layer

Unit: mil

2mil

Maximum diameter of resin plug hole

Unit: mm

0.4mm

Plated hole diameter

Unit: mil

3-5mil

Distance from the wall to the line of the smallest hole

Unit: mil

7mil

Laser hole accuracy

Unit: mm

0.025mm

Minimum BGA pad center distance

Unit: mm

0.3mm

Minimum SMT

Unit: mm

0.25mm

Plated Hole Depression

Unit: um

≤10um

Back Drill/Controlled Deep Drill Tolerance

Unit: mm

±0.05mm

Through-hole plating through-hole capability

Proportion

16:01

Blind Hole Plating Through Hole Capability

Proportion

1.2:1

Minimum BGA Pad

Unit: mm

0.2

Minimum hole diameter (mechanical drilling)

Unit: mm

0.2

Minimum buried hole diameter (laser drilling)

Unit: mm

0.1

Minimum Blind Hole Diameter (Laser Drilled)

Unit: mm

0.1

Minimum Blind Hole Diameter (Mechanical Drilling)

Unit: mm

0.2

Minimum spacing between laser blind holes and mechanically drilled holes

Unit: mm

0.2

Minimum Laser Drilled Hole Diameter

Unit: mm

0.10(depths≤55um)、0.13(depths≤100um)

Minimum BGA pad center distance

Unit: mm

0.3

Interlayer Alignment

Unit: mm

±0.05mm(±0.002″)

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